We are having problems with solderability of the PCB on oursecond side reflow. Everything looks good after reflowon the first side but when we run the second side we have non-wetting of the pads of this side. 
   
  Just to ensure we were doing everything correctly,we switched sides (we did the second side first and then did the first side as a second reflow) and the problem was still after the second reflow. We are thinking this validated our process because the side causing us problems switched with our experiment. As I said in the suject line, this is Immersion Tin. Any suggestions for a cure?
  thanks,
  Larry

 
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