Hi Al!
Sorry about my remark earlier. I kept seeing a blank email and thought
it was some sort of spam...
I don't have the article you were looking for, but I did find this:
http://www.hobbsengr.com/papers/clech_SRS_Model_smi96.pdf
SOLDER RELIABILITY SOLUTIONS: A PC-BASED DESIGN-FOR-RELIABILITY TOOL by
Jean-Paul Clech
It has a section that validated the model with 20, 28, and 68 I/O LCCC's
undergoing accelerated thermal cycling. Maybe there's something in that
paper that can help you out.
Steve Gregory
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of al shirazi
Sent: Monday, July 16, 2007 4:37 PM
To: [log in to unmask]
Subject: [TN] Urgent!
Hello ,
Does any one have this article so I can have a copy please?
I need to have it urgent.
Thanks,
Al
Hall, P. M., "Strain measurements during thermal chamber cycling on
leadless ceramic chip carriers soldered to printed boards", Proceedings,
34th Electronic Components Conference, New Orleans, LA, May 14-16, 1984,
pp. 107-116.
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