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July 2007

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Mon, 16 Jul 2007 12:21:39 -0400
Content-Type:
text/plain
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text/plain (46 lines)
Werner,

Exactly and that IS the debate.

Bev

 

________________________________

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Monday, July 16, 2007 12:14 PM
To: [log in to unmask]; Bev Christian
Subject: Re: [TN] Question about rework of paste in hole solder joints

 

Hi Bev,
I know you know the difference.
Why the debate? If it is adequate, albeit violating IPC standards,
originally, why should that have changed? 

Werner



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