Technetters,
Good morning! We generally do not use PTH parts. As a result, we do
not do wave soldering, but use paste-in-hole or pin-in-paste, chose your
moniker. Because we buy the part in question from two different
suppliers, who make the parts with different dimensions, we have had to
use fairly large, oval holes instead of a more conventional round hole.
And the part leads do not stick out the bottom of the hole either. With
overprinting we have been able to get what is deemed adequate solder
joint strength (and reliability (Yes, I know the difference, Werner.)),
even though the hole fill is not stellar. Wetting angles are good and
proper intermetallics are formed.
Now let's say we do a rework - removing the component, dressing the
hole, inserting a new part and resoldering using hand soldering with
cored wire. The internal debate is whether we should demand hole fill
to meet normal IPC standards or whether we allow the same amount of hole
fill that is allowed for the original paste-in-hole. Opinions and/or
experiences (if you are willing to share the latter :) ) appreciated.
Thanks in advance.
Bev
RIM
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