Hello, Benjamin
Thanks for your great information. That is helpful for CAF issue.
Best reagrds
Jason Liu
Asia Pacific Strategic Sourcing
SDE
TRW Systems Consulting Services(Shanghai) Co., Ltd.
5F, 62 Building, 421 Hongcao Road,
Shanghai 200233, P.R.China
Tel:+86 21 6120 1166 or 6120 2266
Dir Tel:+86 21 6121 1811
Fax:+86 21 6120 7058
Mobile:+86 138 1895 6432
Email:[log in to unmask]
>>> Benjamin Chen <[log in to unmask]> 2007-7-27 11:01 >>>
各位專家好，
我這邊分享一下之前在TPCA研討會得到的經驗。大約四五年前有一位統盟（Yang An
）的專家分享了他們公司對於電化學遷移現象的體驗，也引起現場熱烈的討論。
一直到目前為止的觀察，也大約與IPC ECM手冊中的提示相符。ECM雖然與材料的特性
有關，?是造成ECM問題的原因不只材料一項，Surface Migration的影響原因還少一
些，如果是CAF，電路板製作的流程影響更大，原因是電路板的製作引進了大量的濕
製程、熱、機械應力，均會造成結構的破壞，留給離子遷移的路徑。
另外一項嚴重的問題也是SIR測試程序的本身的不確定度，SIR測試設備的原理是由電
壓的紀?與電流偵測的換算得到電?數值，因此電流測量設備的精確度是一個關鍵，
任何的微量污染均會造成測試結果的差異。
各位其中一個問題是安?的最小間距，在四五年前的那場研討會，我的印象是在場的
專家們大約同意無CAF基板大約為16 mil，有CAF的基板則未知。
另外一個問題是關於測試前後的?值落差很大，因為不知道前後的?值，也無法因此
與該測試的偵測極限與不確定度作比較，所以無法了解該數據是否屬於異常，建議進
行控制變因分析以釐清?值變化的原因所在，也可以將您的數值與IPC的專家討論以
了解其是否屬於異常。
IPC-476A與IPC-9201提供了很多的ECM經驗與研究資料，建議TGAsia也可以成立一個
工作小組進行該資料的翻譯，相信會有助於大家對於ECM問題的處理。
Hope this helps a little,
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
Benjamin Chen
Regional Technical Coordinator, Asia-Pacific
Consulting and Training
Underwriters Laboratories Taiwan Co., Ltd.
Tel: 886-2-2896-7790 ext. 62267, Fax: 886-2-2896-6140
[log in to unmask]
- Know by test, and state the facts. -
Web site: http://www.UL.com.tw
Laya Chen <[log in to unmask]>
Sent by: TGAsia <[log in to unmask]>
07/27/2007 08:55 AM
Please respond to
Asia Committe Task Group Forum <[log in to unmask]>; Please respond to
Laya Chen <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TGA] 答复: [TGA] ?教
??段??有正式的?准或?范?定?距最小安??距。一些厂家可能?部有一些?
准，?是是不公?的。
?所有涉及CAF的要求或??，我??裁BOB Neves?生在?方面做???研究。
Best Regards,
Laya Chen ?燕
Training Coordinator
Microtek Changzhou Laboratories
?可?泰克(常州)??室
Tel: +86 519 5487805
Fax: +86 519 5487810
Email: [log in to unmask]
www.China.TheTestLab.Com
-----?件原件-----
?件人: TGAsia [mailto:[log in to unmask]] 代表 JiaXing LIU
?送??: 2007年7月26日 13:01
收件人: [log in to unmask]
主?: Re: [TGA] ?教
大家也好
我?也有同?的CAF??。
??如果用的是普通的非CAF材料，PTH孔的?距最小安??距是多少不?有CAF的?
?？如果用
anti-CAF的材料的?，PTH孔的?距最小安??距是多少？
Isola 370HR, Tg>=150degrees, Td 340D. core thickness is 0.7mm, 2X7628
core. Total thickness is 1.6mm, 1Oz Copper.
8 pairs of via holes with 15.7mils parallel distance between hole wall
to hole wall. The pair of holes is anode and cathode.
The hole size is 0.35mm. finish is immersion silver.
我?的??要求是８５度和８５％?度， １０００小?．
>>> Li Ruijuan <[log in to unmask]> 2007-7-26 11:23 >>>
大家好!
???于PCB板?孔之?的???抗要求是什么,???件呢,?孔距\孔?有?有要求
?另外,如果??是否?有CAF缺陷,???件怎??定,??
孔?距很大,????后孔???????小很多,可能是什么原因呢?
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