TGASIA Archives

July 2007

TGAsia@IPC.ORG

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Subject:
From:
JiaXing LIU <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, JiaXing LIU <[log in to unmask]>
Date:
Thu, 26 Jul 2007 14:33:49 +0800
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Thanks!!! My brother. 



And the IPC TM 650 is available on IPC website. The CAF relevant test

is in 2.6.25. It is free. 







 



 



>>> 华荣双 <[log in to unmask]> 2007-7-26 12:17 >>>

Dear Jason:

    PCB板两线之间的绝缘阻抗是20M,可用阻抗测试机测,但两过孔之间似未见到相关标准。孔距本厂要求对ANTI

CAF料为12mil,对普通料为14mil,各PCB厂可能不一样,主要与钻孔质量及Desmear有关。关于CAF测试,IPC

TM650上有测试方法,可查阅。

一般湿热试验后,孔壁会吸湿,水的介电常数比基材小,电阻当然会降低。

RS Hua



-----原始邮件-----

发件人: TGAsia [mailto:[log in to unmask]]代表 Li Ruijuan

发送时间: 2007年7月26日 11:24

收件人: [log in to unmask] 

主题: [TGA] 请教







大家好! 



请问关于PCB板过孔之间的绝缘阻抗要求是什么,测试条件呢,对孔距\孔径有没有要求?另外,如果验证是否会有CAF缺陷,实验条件怎样规定,谢谢 



孔间距很大,湿热试验后孔间绝缘电阻却减小很多,可能是什么原因呢? 







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