谢谢各位的回复!



康来辉(LHKang)

Shenzhen Toptouch Consulting Limited Company

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----- Original Message ----- 

From: "Deng, Peter (Shenzhen)" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Tuesday, July 24, 2007 2:22 PM

Subject: Re: [TGA] 请教





康生，陈生，



对于电子元器件的镀层厚度测量，XRF进行非破坏性量测，Cross Section进行破坏性量测，库伦法适应于较薄、厚度较均匀的镀层厚度量测。下面几个镀层厚度的国标供参考，摘录自《电子产品三防技术手册》，马骖等编著：



GB4956-85 磁性测量法，误差小于10％或1.5um的最大值。

GB4957-85 涡流测量法，误差±10％。

GB11250.2-89 X射线光谱测量法，最大测量厚度15um，等效于ASTM-B568-91。

GB5931-86 β射线反向散射法。

GB8015.2-87 光切显微法。

GB5928-86 溶解法。

GB4955-85 库仑法。

GB5929-86 金相显微法。

GB11378-89 轮廓仪法。

ISO3868-76 干涉显微镜法。

ASTM还有一个关于镀层厚度的测量方法，标号忘记了，呵呵。







Peter Deng

**************************************************

Reliability Lab

Electrical & Electronics 

Consumer Testing Services 

SGS Shenzhen branch



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-----Original Message-----

From: TGAsia [mailto:[log in to unmask]] On Behalf Of Jackson Chan

Sent: 2007年7月24日 13:52

To: [log in to unmask]

Subject: Re: [TGA] 请教



Hi LF,



For PCB, I know that different specification is established for different

surface finish



I quote here some related standards



IPC-4552 : ENIG

IPC-4553:  Im Ag

IPC-4554: Im Sn



EDS - XRF (non-destructive method)  is one of method to measure the

thickness.  Certainly, the cross section (see IPC-TM-650 2.1.1) should be

capable , in conjuction with the etching technique if applicable.



Besides, IPC 6010 series specifiesthe plating thickness for different type

of boards.





Regards,



Jackson









                                                                           

             lhkang                                                        

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各位,



      请教一下, 有没有关于电子器件（包括PCB）镀层的测试方面的标准？谢谢！



康来辉(LHKang)



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