Hi LF,
For PCB, I know that different specification is established for different
surface finish
I quote here some related standards
IPC-4552 : ENIG
IPC-4553: Im Ag
IPC-4554: Im Sn
EDS - XRF (non-destructive method) is one of method to measure the
thickness. Certainly, the cross section (see IPC-TM-650 2.1.1) should be
capable , in conjuction with the etching technique if applicable.
Besides, IPC 6010 series specifiesthe plating thickness for different type
of boards.
Regards,
Jackson
lhkang
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各位,
请教一下, 有没有关于电子器件(包括PCB)镀层的测试方面的标准?谢谢!
康来辉(LHKang)