GA Tan,
I am surely not the final word on RoHS rules so I would do the research
and get the latest list of exemptions. However, I believe that the lead
used in the 1st level packaging (connection between die and carrier
substrate) is exempt - see #11 below. I believe these are the current
lead exemptions so far:
1. Lead in glass of cathode ray tubes, electronic components and
fluorescent tubes
2. Lead as an alloying element in steel containing up to 0,35 % lead by
weight, aluminum containing up to 0,4 % lead by weight and as a copper
alloy containing up to 4 % lead by weight
3. Lead in high melting temperature type solders (i.e. tin-lead solder
alloys containing more than 85 % lead)
4. Lead in electronic ceramic parts (e.g. piezoelectronic devices)
5. lead in solders for servers, storage and storage array systems,
network infrastructure equipment for switching, signaling, transmission
as well as network management for telecommunications (with a view to
setting a specific time limit for this exemption)
6. Lead in lead-bronze bearing shells and bushes
7. Lead used in compliant pin connector systems
8. Lead as a coating material for the thermal conduction module c-ring
9. Lead and cadmium in optical and filter glass
10. Lead in solders consisting of more than two elements for the
connection between the pins and the package of microprocessors with a
lead content of more than 80 % and less than 85 % by weight
11. Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated circuit Flip Chip
packages (I believe this is the 1st level packaging)
12. Lead in linear incandescent lamps with silicate coated tubes
13. Lead halide as radiant agent in High Intensity Discharge (HID) lamps
used for professional reprography applications.
14. Lead as activator in the fluorescent powder (1 % lead by weight or
less) of discharge lamps when used as sun tanning lamps containing
phosphors such as BSP (BaSi2O5:Pb) as well as when used as specialty
lamps for diazo-printing reprography, lithography, insect traps,
photochemical and curing processes containing phosphors such as SMS
((Sr,Ba)2MgSi2O7:Pb)
15. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main
amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy
Saving Lamps (ESL)
16. Lead oxide in glass used for bonding front and rear substrates of
flat fluorescent lamps used for Liquid Crystal Displays (LCD)
17. Lead and cadmium in printing inks for the application of enamels on
borosilicate glass
18. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators
used for fibre optic communications systems
19. Lead in finishes of fine pitch components other than connectors with
a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of
fine pitch components other than connectors with a pitch of 0.65 mm or
less with copper lead frames
20. Lead in solders for the soldering to machined through hole discoidal
and planar array ceramic multilayer capacitors
21. Lead oxide in plasma display panels (PDP) and surface conduction
electron emitter displays (SED) used in structural elements; notably in
the front and rear glass dielectric layer, the bus electrode, the black
stripe, the address electrode, the barrier ribs, the seal frit and frit
ring as well as in print pastes
22. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps
23. Lead alloys as solder for transducers used in high-powered
(designated to operate for several hours at acoustic power levels
of 125 dB SPL and above) loudspeakers
24. Lead bound in crystal glass as defined in Annex I (Categories 1, 2,
3 and 4) of Council Directive 69/493/EEC
Thanks
Tony Cosentino
Tekelec
Hardware Engineering
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Tan, Geok Ang
Sent: Tuesday, July 17, 2007 8:48 PM
To: [log in to unmask]
Subject: [LF] RoHS 6 product?
Hi All,
If a product is assembled using lead-free processes 2nd level
connectivity) but one of the ASIC package coming with a internal
Flip-Chip package which is used high temp SnPb solder bumps/balls (1st
level connectivity).
Can the product declare as RoHS 6 product? Or such it be
declares as RoHS 6 with exemption?
Regards
GA Tan
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