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July 2007

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Subject:
RoHS 6 product?
From:
"Tan, Geok Ang" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 18 Jul 2007 09:48:09 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
Hi All,
	If a product is assembled using lead-free processes 2nd level
connectivity) but one of the ASIC package coming with a internal
Flip-Chip package which is used high temp SnPb solder bumps/balls (1st
level connectivity). 
	Can the product declare as RoHS 6 product? Or such it be
declares as RoHS 6 with exemption?
Regards
GA Tan

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