Denny,

I apologize if I'm stating the obvious, but the EMPF article is not 
clear as to definitions. I hope everyone understands that there is a big 
difference between an IPD as a surface mount device (SMT) and an 
embedded passive component buried within a multilayer PCB or HDI 
substrate. IPDs are great for many applications but we still have to 
route the signals to the surface to connect with the IPD as an SMT device.

One of the advantages of embedded components is that they can be placed 
within the footprint of a BGA. No matter how fine the pitch, the 
impedance matching resistor can always terminate the signal within a 
power or ground plane or as a high aspect ratio series resistor, follow 
the trace wherever it goes.

Daniel Brandler
Ohmega Technologies, Inc.