Thank you this sounds interesting.  Another option to investigate.

Thanks





"Bill Kunkle" <[log in to unmask]> 
07/03/2007 11:12 AM
Please respond to
<[log in to unmask]>


To
"TechNet E-Mail Forum" <[log in to unmask]>, "Karen Ebner" 
<[log in to unmask]>
cc

Subject
RE: [TN] When to epoxy heavy components






Karen,

We have had good success modifying ground plane stencil opening design on
castellated lead devices, to minimize movement during reflow. 
Symmetrically
dividing up the large opening into smaller "window panes" allows 
outgassing
thru the streets and promotes a centering effect.

Bill Kunkle
MET Assocs


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Karen Ebner
Sent: Tuesday, July 03, 2007 10:57 AM
To: [log in to unmask]
Subject: Re: [TN] When to epoxy heavy components


Hi Bill

I have a LLCC castellated unit.  As mentioned when it was hand placed I
had no issues now that it is SMT placed it moves during reflow.  Per your
questions before our board is FR 4 and Rogers material.  The ground plane
solder is to minimize noise on our device is to eliminate noise.

Please call me if you have a moment.

If you would also please elaborate more on the statement below would be
great.

 Any component which exceeds 7 grams in weight for every lead of the
device

Thank you

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