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Date: | Tue, 24 Jul 2007 12:09:44 EDT |
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Hi Gebhard,
Mr. Zuverlässigkeit is here; Lee gave an excellent answer, so I did not see
the need for my 5-cents.
At this moment, you have stomped my with IPC White Paper called "Design for
Success"—when and where was it published?
And I do not see the need to specify a maximum barrel wall thickness, 38 [µm]
or otherwise. Typically copper thicknesses are too low. In order to get
knee/corner/shoulder cracks you need a large amount of land rotation; if you have
large plating thickness in the PTH you also have a great Cu thickness at the
surface pad—this would resist land rotation. Now, if you prevent plating on the
surface, then...yes
Just like Lee, I have seen PCB reliability to suffer with the higher LF
soldering temperatrures and the demand on PCB quality [drilling, Cu plating
uniformity, copper plating ductility, adequate copper thickness (1 mil or better yet
1.2 mil)] go up.
That is why I have written my White Paper "Recommendations for PCB FAB Notes
and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free
Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure
Continued Quality."
Werner
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