 
| Sender: |
|
| X-To: |
|
| Date: |
Tue, 24 Jul 2007 13:51:44 +0800 |
| Reply-To: |
|
| Content-type: |
text/plain; charset=GB2312 |
| Subject: |
|
| From: |
|
| X-cc: |
|
| In-Reply-To: |
<002101c7cd9d$42c14370$cedcfea9@1520565009F547F> |
| Content-transfer-encoding: |
base64 |
| MIME-Version: |
1.0 |
| Parts/Attachments: |
|
|
Hi LF,
For PCB, I know that different specification is established for different
surface finish
I quote here some related standards
IPC-4552 : ENIG
IPC-4553: Im Ag
IPC-4554: Im Sn
EDS - XRF (non-destructive method) is one of method to measure the
thickness. Certainly, the cross section (see IPC-TM-650 2.1.1) should be
capable , in conjuction with the etching technique if applicable.
Besides, IPC 6010 series specifiesthe plating thickness for different type
of boards.
Regards,
Jackson
lhkang
<[log in to unmask]
CN> To
Sent by: TGAsia [log in to unmask]
<[log in to unmask]> cc
Subject
2007/07/24 上午 [TGA] 请教
10:49
Please respond to
Asia Committe
Task Group Forum
<[log in to unmask]>;
Please respond to
lhkang
<[log in to unmask]
CN>
各位,
请教一下, 有没有关于电子器件（包括PCB）镀层的测试方面的标准？谢谢！
康来辉(LHKang)
|
|
|
