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Mon, 30 Jul 2007 23:23:19 +0800 |
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CAF is a complex issue, not just a material issue. Even the base material have Anti-CAF, if PCB fabricator did not well control their process, it also fail in CAF testing.
Best regards,
Gary Yu
-----Original Message-----
From: TGAsia 代理 [log in to unmask]
Sent: 30/7/2007 [Mon] 22:28
To: [log in to unmask]
Cc:
Subject: Re: [TGA] 请教E8=AF=B7=E6=95=99?=
个人认为非CAF材料未开纤作Ｍigration测试意义不大，大家谈的测试条件应该满足CUSTOMER COUPON,IPC STD中有SIR TEST COUPON 可参考，
另测试条件应该附加测试电压DC100 or 50V，加速Ｃu离子迁移．
winsun zhao/赵文成
在2007-07-26，"JiaXing LIU" <[log in to unmask]> 写道：
大家也好
我们也有同样的CAF问题。
请问如果用的是普通的非CAF材料，PTH孔的间距最小安全间距是多少不会有CAF的问题？如果用
anti-CAF的材料的话，PTH孔的间距最小安全间距是多少？
Isola 370HR, Tg>=150degrees, Td 340D. core thickness is 0.7mm, 2X7628
core. Total thickness is 1.6mm, 1Oz Copper.
8 pairs of via holes with 15.7mils parallel distance between hole wall
to hole wall. The pair of holes is anode and cathode.
The hole size is 0.35mm. finish is immersion silver.
我们的测试要求是８５度和８５％湿度， １０００小时．
>>> Li Ruijuan <[log in to unmask]> 2007-7-26 11:23 >>>
大家好!
请问关于PCB板过孔之间的绝缘阻抗要求是什么,测试条件呢,对孔距\孔径有没有要求
?另外,如果验证是否会有CAF缺陷,实验条件怎样规定,谢谢
孔间距很大,湿热试验后孔间绝缘电阻却减小很多,可能是什么原因呢?
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