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Subject:	Re: Solder Stencil - Insufficient Solder
From:	"Tempea, Ioan" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:	Mon, 11 Jun 2007 07:45:20 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Gregg,



what about reducing the size of the pads to the size of the pins plus just a very little something, just enough to allow for access of the soldering iron. The very large components that I see having marginal soldering are normally coils, crystals and other of the kind and all of them have oversized pads.



Of course, if after reducing the pad size the paste is overprinted, as already suggested, the problem should go away.



Regards,



Ioan



-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Gregg A. Owens

Sent: Friday, June 08, 2007 2:06 PM

To: [log in to unmask]

Subject: [TN] Solder Stencil - Insufficient Solder





Dear TechNetters:



Continuing with the theme of insufficient solder. Have a student with a similar problem. They have a few SMT components that are very large (in relation to the majority of others on the PCB). These larger components then have insufficient solder necessitating too much touchup/rework to be cost effective. Is there a way to increase the quantity of solder paste being applied to these specific components using a stencil other than increasing the aperture? Any other ideas?



Thanks, 



Gregg Owens, MIT

Manufacturing Technology Training Center, Inc.

Mira Loma, CA 91752



Gregg



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