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June 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Mon, 11 Jun 2007 10:04:36 +0200
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Equal heat distribution, dear Arnoud.
Inge 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: den 11 juni 2007 09:43
To: [log in to unmask]
Subject: Re: [TN] SV: [TN] SV: [TN] Z-axis expansion

Hello,

I did not exactly catch your statement of "securing BGA soldering with a vapour phase". Could you expand on that?
Are you saying that your solution consists in reworking BGAs first and then vapour solder the whole reworked assembly?
I thank you in advance for your insight.
Best regards,

Arnaud Grivon
Hfjord a écrit :
> Agree, we bought a vapour phase inline machine in order to secure the 
> BGA soldering.
> Inge
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
> Skickat: den 9 juni 2007 02:07
> Till: [log in to unmask]
> Ämne: Re: [TN] SV: [TN] Z-axis expansion
>
> Hi Dave,
> This amount of rework, particularly at LF-temperatures, is not a good 
> idea as you surmised. That can consume upwards of 30% of the fatigue 
> life of the
>
> vias, provided they survive the procedure.
> If you indeed to 'cold' solder joints-this would mean SJs near the BGA 
> centers, you need to 'up' the soldering profile. Reworking these is 
> quite hard to do, bnecause it is difficult to get sufficient heat 
> under the BGAs-that is the reason why vapor phase soldering is making 
> a come-back.
>
> Werner
>
>
>
> **************************************
>  See what's free at http://www.aol.com.
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