Hello,
I did not exactly catch your statement of "securing BGA soldering with a
vapour phase". Could you expand on that?
Are you saying that your solution consists in reworking BGAs first and
then vapour solder the whole reworked assembly?
I thank you in advance for your insight.
Best regards,
Arnaud Grivon
Hfjord a écrit :
> Agree, we bought a vapour phase inline machine in order to secure the
> BGA soldering.
> Inge
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
> Skickat: den 9 juni 2007 02:07
> Till: [log in to unmask]
> Ämne: Re: [TN] SV: [TN] Z-axis expansion
>
> Hi Dave,
> This amount of rework, particularly at LF-temperatures, is not a good
> idea as
> you surmised. That can consume upwards of 30% of the fatigue life of the
>
> vias, provided they survive the procedure.
> If you indeed to 'cold' solder joints—this would mean SJs near the BGA
> centers, you need to 'up' the soldering profile. Reworking these is
> quite hard to
> do, bnecause it is difficult to get sufficient heat under the BGAs—that
> is the
> reason why vapor phase soldering is making a come-back.
>
> Werner
>
>
>
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