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June 2007

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 8 Jun 2007 15:26:49 EDT
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Hello Bob, 
 
Lots of questions there for one message... ;-) 
 
There are a couple of different types of vacuum lamination processes  vacuum 
autoclave and vacuum press. The former was developed for  rigid flex in the 
late 1970s and early 1980s and the latter followed to my  recollection as a less 
exotic way to get similar results. The benefits include a  lower pressure 
lamination, air exclusion under vacuum and the ability to  more easily build 
bookbinder type constructions.
 
High and low are relative terms for pressure. The pressure need be only  
enough to cause flow and full encapsulation of all of the features.  Lots of 
things can influence that such as metal thickness and feature density  and spacing, 
material flow to name a few. So in short and in terms  familiar to this 
crowd, it depends. 
 
It is more economical and productive with presses to run them hot and with  
thermal lagging materials, you should not have any major  problems. Autoclaves 
start cold by the nature of the process.
 
Most traditional techniques for lamination registration work  but multilayer 
and rigid flex makers often use internal pins,  sometimes many of them, to 
help keep things aligned. 
 
General dangers?  Hmmm... taking a job in the circuit  manufacturing industry 
in the US perhaps?...  ;-)   
 
Others might have some addition thoughts to share.
 
Welcome back and enjoy. 
 
Joe          
 
In a message dated 6/8/2007 11:17:09 AM Pacific Daylight Time,  
[log in to unmask] writes:

1.  Benefits of vacuum ? 
2. Low pressure vs. High pressure lamination in a  Vacuum press.
3. Cold start up vs. Hot start up
4. Any methods to  control registration in sequential, redundant, as well as
general  lamination 
5. General dangers 







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