How about:
Increasing stencil thickness (and reduce apertures where more solder is
not needed).
Using a stepped stencil - only increase thickness for certain parts.
Solder preforms added by a pick and place machine to complement paste.
Additional paste added by a liquid dispensing machine if available.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gregg A. Owens
Sent: Friday, June 08, 2007 2:06 PM
To: [log in to unmask]
Subject: [TN] Solder Stencil - Insufficient Solder

Dear TechNetters:

Continuing with the theme of insufficient solder. Have a student with a
similar problem. They have a few SMT components that are very large (in
relation to the majority of others on the PCB). These larger components
then have insufficient solder necessitating too much touchup/rework to
be cost effective. Is there a way to increase the quantity of solder
paste being applied to these specific components using a stencil other
than increasing the aperture? Any other ideas?

Thanks, 

Gregg Owens, MIT
Manufacturing Technology Training Center, Inc.
Mira Loma, CA 91752

Gregg

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