Dear all,




I need your help here.  Does IPC have an inspection standard for solder
residue on FPC? If yes, where is it written?





We met a quality issue from our FPC supplier recently. There are solder
residues located on the non conductive area between ZIF connector pads,
these pads are tin-lead plating finished. We think this phenomena is not
acceptable because we are afraid the residues will move during assembly
and cause short problem, but the supplier said that it was acceptable
according to IPC-6013 3.5.2.  I think this standard is for copper trace
and doesn't apply to the ZIF connector pads, but I can't give a right
IPC inspection standard for it. Please let me know which standard I
should follow.  Thanks.




Linda Li   










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