Hi Werner,
Also process chemicals accumulate during PCBs production and not cleaned
properly.
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, June 05, 2007 6:03 PM
To: [log in to unmask]
Subject: Re: [TN] Via Open
Hi Tom,
Not very surprising.
Via barrel failures come from the thermal expansion mismatch of the PCB
in
the z-direction and the ED copper of the barrel wall.
You need good ductility Cu plating of adequate thickness.
I have found that at least some ENIG coatings in the vias further reduce
their ability to withstand this expension mismatch.
Werner
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