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June 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Fri, 29 Jun 2007 11:50:54 -0700
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Like an old Classic Car, who also is not uncomfortable with its bias
plies.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Friday, June 29, 2007 11:43 AM
To: [log in to unmask]
Subject: Re: [TN] - Immersion Silver Bias

As you are well aware from our many 
Dear "Doctor Uncomortable",

As you are well aware from our many years of work together in the Bell
System (Western Electric, AT&T, Bell Laboratories, Lucent
Techechnology)I am extremely biased towards the use of immersion silver
surface finish.  We do have at least one simple legacy product using
ENIG that doesn't make sense to convert.  However, my preference is not
to use ENIG whenever possible.  I don't sell immersion surface finish
chemistry or own any stock in companies who sell chemistry or fabricate
PCB's.  However, I've spent the better part of the past 40 years
addressing solder joint issues in manufacturing as well as doing failure
analysis on customer returns.  My bias is based on the number of ENIG
failures I've seen and the lack of immersion silver issues I've seen.
During the past eleven years I have not see any solder joint failures
due to the use of immersion silver surface finish.

You on the other hand like our other friend Werner may have your own
biases but I know from the many TN posting that you, Werner, as well as
other consultants post continue to work with customers who have ENIG
surface finish issues.  I'm also aware of failure analysis labs who stay
in business because they are continually addressing ENIG failures for
their clients. 

Fortunately, I'm not uncomfortable with my bias.

Regards,
 
George
 
George M. Wenger
Senior Principle FMA / Reliability Engineer
Andrew Corporation Wireless Network Solutions Group
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 (office)   (732) 309-8964 (cell)
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Friday, June 29, 2007 1:39 PM
To: [log in to unmask]
Subject: [TN]

Steve

I have been involved with ENIG failures since '98. The quality of the
ENIG 
chemistry has improved tremendously since then, but I continue to move 
customers from ENIG to other alternatives. Most of this is caused by
black 
pad. The problem is that black pad often requires months to develop and
I 
have not found a reliable test to be used immediately after fabrication
to 
predict whether on not the coating will be black pad prone.
Consequently, I 
am very uncomfortable with ENIG.

Best regards

Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 29, 2007 10:42 AM
Subject: [TN]


> Good Morning to All,
>
> I have a customer who has asked me to do an on-going test for black
pad. 
> The
> test would require me to solder wires onto 624 BGA pads and then pull
on 
> the
> wires to determine if there is black pad . They have given me no
criteria 
> in
> terms of pull strength or what constitutes pass/fail. I obviously need

> some
> kind of pull tester to do this. Has anyone done anything similar? Any
> thoughts or ideas would be appreciated. Regards Steve Kelly
>
>
>
> Steve Kelly
>
> (416) 750-8433 (work)
>
> (416) 750-0016 (fax)
>
> (416) 577-8433 (cell)
>
>
>
>
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