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June 2007

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Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Fri, 29 Jun 2007 14:43:04 -0400
Content-Type:
text/plain
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text/plain (161 lines)
As you are well aware from our many 
Dear "Doctor Uncomortable",



As you are well aware from our many years of work together in the Bell

System (Western Electric, AT&T, Bell Laboratories, Lucent

Techechnology)I am extremely biased towards the use of immersion silver

surface finish.  We do have at least one simple legacy product using

ENIG that doesn't make sense to convert.  However, my preference is not

to use ENIG whenever possible.  I don't sell immersion surface finish

chemistry or own any stock in companies who sell chemistry or fabricate

PCB's.  However, I've spent the better part of the past 40 years

addressing solder joint issues in manufacturing as well as doing failure

analysis on customer returns.  My bias is based on the number of ENIG

failures I've seen and the lack of immersion silver issues I've seen.

During the past eleven years I have not see any solder joint failures

due to the use of immersion silver surface finish.



You on the other hand like our other friend Werner may have your own

biases but I know from the many TN posting that you, Werner, as well as

other consultants post continue to work with customers who have ENIG

surface finish issues.  I'm also aware of failure analysis labs who stay

in business because they are continually addressing ENIG failures for

their clients. 



Fortunately, I'm not uncomfortable with my bias.



Regards,

 

George

 

George M. Wenger

Senior Principle FMA / Reliability Engineer

Andrew Corporation Wireless Network Solutions Group

40 Technology Drive, Warren, NJ 07059

(908) 546-4531 (office)   (732) 309-8964 (cell)

 



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker

Sent: Friday, June 29, 2007 1:39 PM

To: [log in to unmask]

Subject: [TN]



Steve



I have been involved with ENIG failures since '98. The quality of the

ENIG 

chemistry has improved tremendously since then, but I continue to move 

customers from ENIG to other alternatives. Most of this is caused by

black 

pad. The problem is that black pad often requires months to develop and

I 

have not found a reliable test to be used immediately after fabrication

to 

predict whether on not the coating will be black pad prone.

Consequently, I 

am very uncomfortable with ENIG.



Best regards



Lee

J. Lee Parker, Ph.D.

JLP Consultants LLC

804 779 3389





----- Original Message ----- 

From: "Steve Kelly" <[log in to unmask]>

To: <[log in to unmask]>

Sent: Friday, June 29, 2007 10:42 AM

Subject: [TN]





> Good Morning to All,

>

> I have a customer who has asked me to do an on-going test for black

pad. 

> The

> test would require me to solder wires onto 624 BGA pads and then pull

on 

> the

> wires to determine if there is black pad . They have given me no

criteria 

> in

> terms of pull strength or what constitutes pass/fail. I obviously need



> some

> kind of pull tester to do this. Has anyone done anything similar? Any

> thoughts or ideas would be appreciated. Regards Steve Kelly

>

>

>

> Steve Kelly

>

> (416) 750-8433 (work)

>

> (416) 750-0016 (fax)

>

> (416) 577-8433 (cell)

>

>

>

>

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