Steve

I have been involved with ENIG failures since '98. The quality of the ENIG 
chemistry has improved tremendously since then, but I continue to move 
customers from ENIG to other alternatives. Most of this is caused by black 
pad. The problem is that black pad often requires months to develop and I 
have not found a reliable test to be used immediately after fabrication to 
predict whether on not the coating will be black pad prone. Consequently, I 
am very uncomfortable with ENIG.

Best regards

Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 29, 2007 10:42 AM
Subject: [TN]


> Good Morning to All,
>
> I have a customer who has asked me to do an on-going test for black pad. 
> The
> test would require me to solder wires onto 624 BGA pads and then pull on 
> the
> wires to determine if there is black pad . They have given me no criteria 
> in
> terms of pull strength or what constitutes pass/fail. I obviously need 
> some
> kind of pull tester to do this. Has anyone done anything similar? Any
> thoughts or ideas would be appreciated. Regards Steve Kelly
>
>
>
> Steve Kelly
>
> (416) 750-8433 (work)
>
> (416) 750-0016 (fax)
>
> (416) 577-8433 (cell)
>
>
>
>
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