Bev,
The tester you are talking about is most probably their high speed shear
one, while Steve had been asked to pull soldered wires (which sounds
WEIRD!!!).
Steve,
There are no criteria (at least the force value-wise) for that. What
they might have meant was a criteria based on the fracture path. There
is a good technical report (A. Eslambolchi, P. Johnson, M. Kaufmann and
Z. Mei: Electroless Ni/Immersion Au Evaluation - Final Program Report,
HP-EADC, September 1998, pp. 1-64), which your customer might want to
read/
Regards,
Vladimir
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, June 29, 2007 12:56 PM
To: [log in to unmask]
Subject: [TN]
Steve,
This is crazy, unless you have developed a bad reputation for producing
Black Pad, which I doubt.
If you want to see one of the Dage testers they are talking about, come
see me.
Why not just take some panels and dissolve off the gold with potassium
thiocyanate and see what the nickel looks like?
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Friday, June 29, 2007 10:42 AM
To: [log in to unmask]
Subject: [TN]
Good Morning to All,
I have a customer who has asked me to do an on-going test for black pad.
The
test would require me to solder wires onto 624 BGA pads and then pull on
the
wires to determine if there is black pad . They have given me no
criteria in
terms of pull strength or what constitutes pass/fail. I obviously need
some
kind of pull tester to do this. Has anyone done anything similar? Any
thoughts or ideas would be appreciated. Regards Steve Kelly
Steve Kelly
(416) 750-8433 (work)
(416) 750-0016 (fax)
(416) 577-8433 (cell)
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