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June 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Fri, 29 Jun 2007 09:47:12 -0700
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text/plain
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Part of me wants to say that is shear lunacy.
 I would suggest reflowing solder balls to the pads and due a pull/shear
test. There are several test reports and Equipment people that could
help you with this. The goal would be to have a cohesive failure of the
solder ball. All that does is establish, regardless of the undefined
anomaly, that an acceptable adhesion can be attained at the ball/pad
interface.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Friday, June 29, 2007 7:42 AM
To: [log in to unmask]
Subject: [TN]

Good Morning to All,

I have a customer who has asked me to do an on-going test for black pad.
The
test would require me to solder wires onto 624 BGA pads and then pull on
the
wires to determine if there is black pad . They have given me no
criteria in
terms of pull strength or what constitutes pass/fail. I obviously need
some
kind of pull tester to do this. Has anyone done anything similar? Any
thoughts or ideas would be appreciated. Regards Steve Kelly

 

Steve Kelly

(416) 750-8433 (work)

(416) 750-0016 (fax)

(416) 577-8433 (cell)

 


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