Paul you mention that bare copper is not an option do you know anything
about Direct Immersion Gold. I'm not sure if it is a viable finish but
here is the link to a site that mentions it.
http://www.uyemura.com/library-3.htm
Scott Lefebvre
-----Original Message-----
From: Whittaker, Dewey (EHCOE) [mailto:[log in to unmask]]
Sent: Monday, June 18, 2007 10:05 AM
Subject: Re: Plating
So you're saying it is a real enigma?
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Tuesday, June 12, 2007 4:09 PM
To: [log in to unmask]
Subject: Re: [TN] Plating
Paul:
If you are using Electroless Nickel/Immersion Gold, you will need a
barrier metal which is not only a barrier, but which also allows
Immersion Gold to plate. You see, the Nickel interacts with the
immersion Gold, and facilitates plating. And whereas many metals can,
in theory, be used as barrier metals, it is not obvious which of them
would allow/facilitate immersion Gold plating on top.
Then you step into the other questions, such as whether the alternate
barrier metal will cause hardening of the assembly solder. This is not
a simple question to answer.
Rudy Sedlak
RD Chemical Company
"Stolar, Paul W" <[log in to unmask]> wrote:
We are using nickel as a barrier metal on a PC board for the pads.
Are there any other barrier metals we can use which are non-magnetic.
Bare copper is not an option.
Paul Stolar
Materials/Reliability Engineer
Manufacturing Reliability Lead Engineer
Baker Atlas
713-625-5376
713-625-4949 (fax)
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