Wayne,
So it's Fodel technology! Thought it was something else.
OK, if the article was about Fodel, I've also tried. We got rather
well defined 1 mil lines as well. Problem was we did not want that
thickness, about 10 microns. We wished to get some 2-3 microns only, and
as you know, then you get too porous conductors.
AIT offers etched copper on AlN substrates, also good, but not useful
as multilayers. So, we do now as most do: Teflon boards with etched 1
mil lines for high RF range, and ordinary multilayer boards for digital
signals and lower analogue signals. Fodel became no hit, as many
thought.
Not much new in this game...same today as it was 20 years ago. Raychem,
IBM and others experimented with multilayer thinfilm, very impressive,
but does not fit today when everything must be cheap, cheap, cheap..
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Wayne Thayer
Skickat: den 18 juni 2007 21:29
Till: [log in to unmask]
Ämne: Re: [TN] Looking for a report III
Hi Inge!
I have done thick film gold etching--the results are easy and very
pretty. Spin on positive photo-resist. Very good results with co-fired
gold on LTCC because shrinkage minimizes voids. DuPont had or has a few
decent products for this: Fodel, 5771, and the cofired LTCC stuff.
Etchant is potassium iodide. Turns everything yellow--almost as bad as
FeCl. We were able to achieve 1mil lines with 1.5 mil space, but was a
real pain since AOI can't inspect that level of detail very well and
standard photoplots are at the limits of their resolution.
Wayne
>>> [log in to unmask] >>>
Hi, anyone happen to have this report?
THIN PRINT ETCHABLE GOLD-AN ALTERNATIVE TO THICK AND THIN FILM
HSU, K.F.
08 Oct 1986
ADVANCED MICRODEVICES
Inge
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