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June 2007

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Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 18 Jun 2007 10:59:01 EDT
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text/plain
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Good (time of day here) colleagues,
 
Does anyone know of a statistical base that identifies assembly failures  and 
traces them to causes with some sort of breakdown? 
 
That is failures traced to assembly only (e.g., opens, shorts,  insufficient 
cleaning, etc.), failures related to PCB manufacturing only (e.g.,  PTH 
failure, opens, shorts, CAF, etc.) and failures traced to the  components themselves 
of any cause (ESD, overheating, thermal cycling failure,  etc.). 
 
I realize that this may be a sensitive topic for some folks and am  thus open 
to taking any such data off line. 
 
However any perspective based on experience and "guessimates" from the  
general audience is encouraged and most welcomed to see if there is any kind of  
consensus of experience and how close it matches with the the industry's general 
 perceptions. 
 
Rough (in the same city at the ball park) estimates are OK.
 
Thanks in advance for any form of light that can be shed while  I fumble 
around in the dark feeling for the "main lightswitch".  ;-) 
 
Best to all, 
Joe 



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