Hi John!
We're building boards right now in a leaded process that has one BGA that we can't get any other way but Lead-free. So we send that part out to get re-balled with leaded spheres. We've got other BGA's and components on the board that are made for a leaded process and do not want to risk them to the higher reflow temperatures that would be required to properly reflow a lead-free BGA.
Dave Hillman has a good paper out that he presented at CMAP in 2005:
http://www.aciusa.org/lfpdf/lfjournal/CMAP_paper_Rev_A_(2).pdf
This blog from Circuits Assembly says that it's really not a good idea to mix alloys:
http://circuitsassembly.com/blog/?p=29
So for all the above reasons we decided to avoid all that and get the BGA re-balled...
Steve Gregory
----- Original Message ----
From: John Foster <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, June 15, 2007 11:19:59 AM
Subject: [TN] BGA's and lead free
I am sure this has been beat to death.
If you have BGA's with lead free balls can you solder these
in a leaded process.
I have 7 different BGA's on this board
So if they are all leaded and I go with a leaded process life is good.
If they are all lead free and I go with a lead free process life is good.
But what if I can't get them all in one flavor.
I know that one way is really bad. Isn't it soldering lead free parts in
a leaded process? I could imagine that you won't get hot enough
to reflow the lead free balls. But what about using non lead free
BGA's in a lead free world.
Any input on this will really be appreciated.
Thank You
John Foster
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