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June 2007

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Subject:
Re: Reflow Ovens for Printed Circuit Boards
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ted Tontis <[log in to unmask]>
Date:
Fri, 15 Jun 2007 10:34:22 -0500
Content-Type:
text/plain
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text/plain (55 lines) 
Werner,
    From my understanding this was supposed to minimize the time it takes to
profile an assembly. It is still the responsibility of the Manufacturing
engineer to make sure what was calculated is correct.
    I left there before I could see it tested out against data collected
from actual profiled assemblies.

Ted
----- Original Message ----- 
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 15, 2007 9:12 AM
Subject: Re: [TN] Reflow Ovens for Printed Circuit Boards


> Hi Ted,
> DataPaq would have to have a huge component library for these kind of
> estimates to come even close to being accurate. I would need to see data
developed
> with DataPaq and actual measurements that are ratrher close before I would
trust
> this.
>
> Werner
>
>
>
> **************************************
>  See what's free at http://www.aol.com.
>
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