ECD have the same type of software (the Expert); you plug in the biggest and the smallest comp, plus some PCB characteristics, plus the paste type, plus the oven (they have comprehensive databases) and it will give you a recommended recipe. The thing is that you really have to validate it, although the prediction is close. The thing is based on the signature of each oven, that you get passing a standard board in the oven.
This software in itself is very good if you want to reduce the number of trials, but it will not give you the rigor you seem to request. We tried to use it to facilitate the transfer of the recipes between various ovens, but you still have to validate. We thought that if we have the various signatures, if we take a recipe that was tweaked for one machine, we would simply run the recipe through the signature of another oven and the outcome will be plug and play, but it turned out that this is not 100% reliable.
Good luck,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ted Tontis
Sent: Friday, June 15, 2007 9:55 AM
To: [log in to unmask]
Subject: Re: [TN] Reflow Ovens for Printed Circuit Boards
I was recently working for a contract manufacturer and we were looking into
profiling all the assemblies. We wanted to have specific profiles for all
assemblies, Pb free and Pb. We looked at a system that I think was from
DataPaq. Basically you would send down a special data logger that would
profile the reflow oven. You would then plug in the data from the data
logger and the dimensions of the assembly you wish to reflow and get a close
approximation of what the profile should be. If you have a ton of assemblies
you need to profile this will get you that much closer without spending a
ton of time sending board after board through the oven or trashing an
expensive assembly. I left before they had a chance to test it out, so I can
not say for sure how accurate the estimations were. The down side was that
you had to buy the special data logger that you would only use once to
profile the oven and never use it again except for, auditing your oven or
after doing an overhaul on the oven and it was pricey.
Ted
----- Original Message -----
From: "N Burtt" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 15, 2007 3:22 AM
Subject: Re: [TN] Reflow Ovens for Printed Circuit Boards
OK it is Friday - and try as I might, can't resist picking on the typo for
a "larger thermal ass"... I guess you just mean "big-a**ed" components?
But seriously with SnPb we found we got away with one profile for pretty
much all shapes and sizes of PCBs. With lead-free we have found it important
to trim the basic recipe to suit each and every design, making sure we
profile
a scrap board with a thermocouple on those parts we are concerned about
(both thermally senstive =low max reflow temp/small thermal Mass and large
thermal Mass)
Nigel
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