Hello Steve,
Thanks for your reply. I was saying solder particles NOT flux residues.
Does IPC-610 also apply to bare FPC? I thought it applied to assembled
circuit board only.
Linda
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Friday, June 01, 2007 9:42 PM
To: [log in to unmask]
Subject: Re: [TN] Solder residue on FPC
Hi Linda!
When you say solder residues, are you saying that there is actually
SOLDER particles (such as solderballs, etc.) between the pads? Or do you
mean flux residues?
If it's solder particles, it's definitely a defect for all classes.
That's under 10.4.2 in the IPC-610 under particulate matter. If you mean
flux residues, it depends. Flux residues are addressed in section 8 in
the J-STD-001, and in 10.4 and 10.4.1. Some flux residues may be allowed
if verified not to be harmful.
Steve Gregory
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Li, Linda
Sent: Friday, June 01, 2007 3:49 AM
To: [log in to unmask]
Subject: [TN] Solder residue on FPC
Dear all,
I need your help here. Does IPC have an inspection standard for solder
residue on FPC? If yes, where is it written?
We met a quality issue from our FPC supplier recently. There are solder
residues located on the non conductive area between ZIF connector pads,
these pads are tin-lead plating finished. We think this phenomena is not
acceptable because we are afraid the residues will move during assembly
and cause short problem, but the supplier said that it was acceptable
according to IPC-6013 3.5.2. I think this standard is for copper trace
and doesn't apply to the ZIF connector pads, but I can't give a right
IPC inspection standard for it. Please let me know which standard I
should follow. Thanks.
Linda Li
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