Paymon,

Another consideration if you get to work with the Designer.

1. You may want to specify ENIG over soldermask to minimize the Nickel barrier over most of the routing.

2. You may also want to specify thinner Nickel than is called out in the IPC spec (I tried to get more RF consideration done when the spec was written, but digital ruled at the time). I would suggest 50 to 150 microinches rather than the thicker requirement of the IPC spec.

We found thinner Nickel still worked for protection and helped improve RF performance over thicker Nickel.

As freq and speed goes up, so goes the effect of the Nickel barrier, so minimizing the barrier should improve performance.

Good luck and let us know your final solution please.

Thanks,

FNK



Frank N Kimmey CID+

Princpal PCB Designer

PIDC-PCB Stream Manager

Mobile - 916-670-0645



----- Original Message -----

From: TechNet <[log in to unmask]>

To: [log in to unmask] <[log in to unmask]>

Sent: Wed Jun 13 13:23:05 2007

Subject: Re: [TN] Plating



Hello Werner,



I am going to review this with the designer for his feedback, thank you.



By the way, I have reviewed your training material. I plan to purchase

it with my first budget when I join my company's corporate Quality

engineer position.



Regards,

Paymon



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier

Sent: June 13, 2007 3:19 PM

To: [log in to unmask]

Subject: Re: [TN] Plating



Hi Paymon,

The electrical properties are:

Soldered to Cu: 1.67 micro-ohm/cm; 0.6 micro-dB/cm

Soldered to Ni: 90 micro-ohm/cm; 4.7 micro-dB/cm



Werner







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