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June 2007

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TechNet E-Mail Forum <[log in to unmask]>, Hfjord <[log in to unmask]>
Date:
Wed, 13 Jun 2007 22:21:35 +0200
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Right, if you know dark paths of ENIG, you can use it up to 60 GHz! We
did. After ENIG, another layer of Cu and Au. No, I don't tell about
thicknesses.
Inge

-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Dwight Mattix
Skickat: den 13 juni 2007 20:25
Till: [log in to unmask]
Ämne: Re: [TN] Nickel barrier and RF applications

The lossy effects of Ni are long established. However, many successfully

use it at high freq.

In many (most?) cases the Ni effects can be modeled and tuned in circuit

design.

fwiw, We have a satcom mobile earthstation app with complex microstrip 
filters and couplers running at 14GHz on ENIG.
Going on 20 years now and still producing/updating the system, still
using 
ENIG.

for the record:
ENIG is the worst surface finish we've ever used.
Except for everything else we've tried.   ;^)


dw

At 10:57 AM 6/13/2007, Stadem, Richard D. wrote:
>Inge and Vlad
>Keep in mind that Paymon is reflowing the entire assembly, not just
>reworking a BGA site.
>Therefore what you just described is happening over the entire assembly
>to all of the solder joints.
>This cumulative effect could theoretically create a noticeable
>improvement in the RF performance of the circuitry.
>
>-----Original Message-----
>From: Hfjord [mailto:[log in to unmask]]
>Sent: Wednesday, June 13, 2007 12:13 PM
>To: 'TechNet E-Mail Forum'; Stadem, Richard D.
>Subject: SV: [TN] Nickel barrier and RF applications
>
>For each repeated reflow, more and more nickel participates in building
>nickel/tin intermetallics. These IMCs are not ferromagnetic. So, let's
>assume that Paymon's electroless nickel is just some 2-3 micrometers
>thick, which is not unusual, then a growth of the IMC by some 0.1 to
0.5
>micrometer for each reflow will probably have a positive effect = less
>magnetic.
>Just an analogue thought
>Inge
>
>
>I think, there is one question to ask. If ENIG (or rather the presence
>of Ni) is the source of the problem, then why does 2nd reflow improves
>the yield?
>
>
>Regards,
>
>Vladimir
>AMD
>
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