And it precipitates, not participates. The only thing nickel
participates in is creating brittle-nickel syndrome and BP! Ain't I an
old fussy fluxxer! 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, June 13, 2007 12:57 PM
To: [log in to unmask]
Subject: Re: [TN] Nickel barrier and RF applications

Inge and Vlad
Keep in mind that Paymon is reflowing the entire assembly, not just
reworking a BGA site.
Therefore what you just described is happening over the entire assembly
to all of the solder joints. 
This cumulative effect could theoretically create a noticeable
improvement in the RF performance of the circuitry. 

-----Original Message-----
From: Hfjord [mailto:[log in to unmask]]
Sent: Wednesday, June 13, 2007 12:13 PM
To: 'TechNet E-Mail Forum'; Stadem, Richard D.
Subject: SV: [TN] Nickel barrier and RF applications

For each repeated reflow, more and more nickel participates in building
nickel/tin intermetallics. These IMCs are not ferromagnetic. So, let's
assume that Paymon's electroless nickel is just some 2-3 micrometers
thick, which is not unusual, then a growth of the IMC by some 0.1 to 0.5
micrometer for each reflow will probably have a positive effect = less
magnetic. 
Just an analogue thought
Inge


I think, there is one question to ask. If ENIG (or rather the presence
of Ni) is the source of the problem, then why does 2nd reflow improves
the yield?


Regards,

Vladimir
AMD

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------