TECHNET Archives

June 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Tue, 12 Jun 2007 11:00:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (58 lines)
Registration now open!

PCB Fabrication "Back to the Basics" Webcast Series 
August 9, 16, & 23, 2007 10:00 am - 11:00 am (CDT) 

In this webcast series, Michael Carano, of Electrochemical, Inc. will
identify and explain the basics of printed circuit board fabrication.
You will gain extensive practical knowledge in troubleshooting
techniques. You'll learn how to identify the effects of up and down
stream processes in the PCB fabrication process, while learning the
latest in processing alternatives, and quality control.

Basics of Multilayer 
August 9, 2007 - 10:00 am - 11:00 am (CDT)

Join us for this first in the "Back to the Basics" series. An overview
of materials and resin systems will be provided. Multilayer fabrication
in regard to surface preparation and imaging and circuit formation and
innerlayer treatment adhesion promotion is explored. Information on
lamination with reference to lay-up, press cycles, post press cycle
operation and process effects due to lamination will also be shared.

Via Formation and Metallization
August 16, 2007 - 10:00 am - 11:00 am (CDT)

Learn everything you need to know about via formation and metallizaton.
This second webcast in the series will feature via formation with
reference to drilling basics, feeds and speeds, drill bit quality and
the effect of drilling on hole wall quality. Desmear/etchback with
reference to material concerns will also be explored.

Electroplating Technologies
August 23, 2007 - 10:00 am - 11:00 am (CDT)

The third webcast in the series will discuss electroplating technologies
(i.e., pattern and panel plating), and provide an overview of the
plating process and factors affecting plating distribution and throwing
power. Don't miss out on this opportunity to learn everything you need
to know about the electroplating process!

Registration Information:  Each webcast will begin at 10:00 am (US
Central Daylight Savings Time) and conclude at 11:00 am (US Central
Daylight Savings Time).

Looking for savings?  Register by July 9, 2007, and save an additional
10% off of the current prices!  Cut and paste www.ipc.org/PWBFabSeries
into your browser and download the registration form.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2