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Date: | Fri, 29 Jun 2007 13:39:29 -0400 |
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Steve
I have been involved with ENIG failures since '98. The quality of the ENIG
chemistry has improved tremendously since then, but I continue to move
customers from ENIG to other alternatives. Most of this is caused by black
pad. The problem is that black pad often requires months to develop and I
have not found a reliable test to be used immediately after fabrication to
predict whether on not the coating will be black pad prone. Consequently, I
am very uncomfortable with ENIG.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: "Steve Kelly" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, June 29, 2007 10:42 AM
Subject: [TN]
> Good Morning to All,
>
> I have a customer who has asked me to do an on-going test for black pad.
> The
> test would require me to solder wires onto 624 BGA pads and then pull on
> the
> wires to determine if there is black pad . They have given me no criteria
> in
> terms of pull strength or what constitutes pass/fail. I obviously need
> some
> kind of pull tester to do this. Has anyone done anything similar? Any
> thoughts or ideas would be appreciated. Regards Steve Kelly
>
>
>
> Steve Kelly
>
> (416) 750-8433 (work)
>
> (416) 750-0016 (fax)
>
> (416) 577-8433 (cell)
>
>
>
>
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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