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May 2007

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Subject:
From:
Paymon Sani <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paymon Sani <[log in to unmask]>
Date:
Tue, 8 May 2007 08:20:20 -0400
Content-Type:
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text/plain (105 lines)
We had a similar challenge with our RF boards and their shields. We were
able to achieve an acceptable RF shield assembly process yield by
improving the shield frame tolerances and dispensing solder paste to
increase the solder paste volume (height) before the reflow process. The
design requirement does not allow for any voids wider than 1 mm. This is
a high frequency (above 5 GHz) application.

Paymon


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: May 8, 2007 8:09 AM
To: [log in to unmask]
Subject: Re: [TN] RF shields

Iona,
It depends on the RF design - frequency, power, other shielding
materials in the overall product.  You need to check with the RF
designers and/or have them do a signal leakage check.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Tuesday, May 08, 2007 8:06 AM
To: [log in to unmask]
Subject: [TN] RF shields

Hi everybody,

I have a very demanding RF board which has fifteen 2"x2" and five 2"x1"
fences. They are pretty tricky, as they tend to lift corners and require
a lot of rework.

The question is: is it possible not to solder the fences to the PCB, but
only clip them on the opposite side? Is soldering a must for the RF
performance?

Thanks,

Ioan

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