Reuven,
are you guys really soldering at 260C? That's 40C above liquidus for the coldest joint, which brings you a lot higher in the other places! 240C gives us very good soldering.
Also Miguel, the lead-free solders generally require a higher soak, around 180C. These values are normally presented in the TDS of the solder.
Regards,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Reuven Rokah
Sent: Tuesday, May 08, 2007 6:41 AM
To: [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305
Usually the recommended temp. for SN100 is 5 deg higher (265degC) than SAC (260 degC).
May be those 5 degC cause the blow holes in wet or old date codes PCBs / components.
Best Regards
Reuven ROKAH
e mail: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Miguel Vallejo
Sent: Tuesday, May 08, 2007 12:04 AM
To: [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305
Hi Yannick,
You need to make sure you're not introducing moisture in the solder, by
opening the jar while the solder is cold; allow it to come to room
temperature before opening the jar. This can take 4-6 hrs, so a suggestion
is to bring it out at the end of the day for next day use, or one shift
brings out at the beginning of the shift for next shift's use.
Furthermore, the process window is much smaller, so the ramp-up deg/sec,
soak time at about 150 degC, spike rate and pick temp variations are less
forgiving.
I would recommend a ramp-up (to 150 deg C)of 2-3 degC/sec and soak at about
150-160 deg C, for about 1.5 mins. then spike to reflow in about 30 secs.
Stay at liquidous for about 45 secs. One visual check is to make sure the
flux residue looks wet, not burnt.
Let me know if this helps, good luck.
Miguel
-----Original Message-----
From: Yannick Brisson [mailto:[log in to unmask]]
Sent: Monday, May 07, 2007 4:50 AM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] SN100C vs. SAC305
Hi,
You wrote that you use FCT SN100C since 1 year, we usually use it in
our product but since 1 month we found some blow hole and void in our SMD
solder joint, we use immersion tin plating. We spoke with their guru's but
we are unable to find any reason for that. Those blow hole and voids are
most of the times on LED with gold plating, do you have some ideas for us to
solve our problem??
Thank You
Yannick
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]]De la part de Miguel Vallejo
Envoyé : 30 avril, 2007 18:21
À : [log in to unmask]
Objet : Re: [TN] SN100C vs. SAC305
I've been using FCT SN100C for both SMT and TH. I started using this alloy
since May 06. I've run around 30K boards, since, with no problems. Once
dialed-in, the process is very stable, and results very predictable. What I
love the most about this alloy is that the appearance is very similar to the
leaded solder, so there is no need for second criteria for acceptability.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, April 30, 2007 11:42 AM
To: [log in to unmask]
Subject: [TN] SN100C vs. SAC305
Dear Technos,
I need to know how is this combat evolving. This topic has been brought up
several times, but things change fast right now and there must be more
empirical data on the matter.
What I know regarding the 2 materials can be summarized:
* Pro SN100C: cheaper, better looking, eats less copper in the TH
* One major unknown - the Reliability: SN100C is not available in
solder paste format, therefore the boards would have SAC SMT joints and
SN100C TH joints. This means 2 different materials and since we don't know
how reliable a board with only one material is, should we risk introducing
an extra variable?
I would like to know what your take is. Does anybody mixes the 2 materials?
Any reliability testing done? How long have you been doing it and do you see
RMAs?
Thanks,
Ioan
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