Hi Wegner,

Thank you for the clarification.

 

  _____  

From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Monday, May 07, 2007 3:49 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305

 

Hi Miguel,
I have no problems with the first part of your recommendation:



I would recommend a ramp-up (to 150 deg C)of 2-3 degC/sec and soak at about
150-160 deg C, for about 1.5 mins. then spike to reflow in about 30 secs.


The problem starts here:



Stay at liquidous for about 45 secs


That does not mean very much and may be totally inadequate depending on your
assembly. To have assured good wetting, provided good solderability, the
slowest heating solder joint needs to be a Liquidus+20C for at least 5
seconds [all other joints will be at higher T's for longer times]

Werner



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