Hi Miguel,
I have no problems with the first part of your recommendation:
> I would recommend a ramp-up (to 150 deg C)of 2-3 degC/sec and soak at about
> 150-160 deg C, for about 1.5 mins. then spike to reflow in about 30 secs.
> 
The problem starts here:
> Stay at liquidous for about 45 secs
> 
That does not mean very much and may be totally inadequate depending on your 
assembly. To have assured good wetting, provided good solderability, the 
slowest heating solder joint needs to be a Liquidus+20C for at least 5 seconds [all 
other joints will be at higher T's for longer times]

Werner



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