TECHNET Archives

May 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Marsico, James
Date:
Thu, 31 May 2007 08:20:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (89 lines)
Terry, couldn't you add electrically isolated vias under the component
for thermal transfer?  You'd have to add a thermally conductive
adhesive, though, to get the heat from the component body to the vias.

Jim Marsico
EDO Corporation
1500 New Horizons Blvd.
North Amityville, NY 11701
631-630-5079
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Terry Kozlyk
Sent: Thursday, May 31, 2007 7:02 AM
To: [log in to unmask]
Subject: [TN] Conductive Cooling thru Pre-Prig material

Technetters;

 

I have a 6 layer PCB with about 8 HOT DPAK components. The tabs are
electrically hot so I cannot just draw the heat directly thru a copper
fill
brought out to the edge of the PCB.

 

I need electrical isolation, BUT high thermal conductivity between 2
adjacent layers.

 

Can anyone recommend what material they have specified to be used for
pre-prig that conducted the heat to the adjacent layer?

 

Voltage max is about 50 volts so I could probably go down to 2 or 3 mil
pre-prig.

 

Nothing special about this PCB; about 5" x 5".

 

The fab houses I solicited for info still haven't replied so I am
curious.

 

Any leads, products or websites would be appreciated.

 

Regards

TDK


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2