Steve,
In my opinion , to make things simple in the beginning, and to avoid big 
expenses, maybe your client must see that your reflow profile in the failed 
locations is the correct one and similar to the profile on other locations 
where there are no failures.
This is in order to show that you established the correct one for the 
assembly, and for the parts in general.
(You know of course how to do it with local thermocouples)
If the failure appeared suddenly after having had good results before, look 
for a change (component make or manufacturer) or circuit change ( artwork or 
manufacturer).
If it is the first time you manufacture these circuits, and your profile and 
stencil  are correct as required by the component manufacturer in his 
appliccation notes, the client can not pretend that your work is not 
correct. After all, you are ASSEMBLING.
However, in order to correct the problem, if you decide to use a laboratory, 
you should decide what relevant information you need , and this is where the 
expert comes in.

Gaby
----- Original Message ----- 
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 30, 2007 11:24 PM
Subject: Re: [TN] Solder Joint Analysis Lab Recommendations?


> Hi Steve,
> Most commercial labs will do a very good job determining whether what you
> sent tem meets whatever spec is applicable. In most cases, they will not 
> do
> interpretive work or root cause analysis.
> Excellent labs are Robisan, Microtek, Trace, and others—typically, the 
> best
> are rather active within the IPC.
> For interpretive work or root cause analysis you need a consultant like 
> me.
>
>
>
> Werner
>
>
>
> **************************************
> See what's free at http://www.aol.com.
>
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