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May 2007

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From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev <[log in to unmask]>
Date:
Fri, 4 May 2007 17:12:53 -0400
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Hi Dave,



I'm lost:-) how come you know there was no Au in the areas where we see Ni?



Brittlle Failed ENIG joints wqill have a similar "muddy" appearance



Regards,



Vladimir



-----Original Message-----

From: TechNet

To: [log in to unmask]

Sent: Fri May 04 16:45:09 2007

Subject: Re: [TN] Metalurgists, need assistance



Hi folks and thank you Steve for being "TechNet Picture Central"!  Sorry 

but just to warn everyone but I am going to use the "B" word shortly. Inge 

- take a close look at picture 4. As Werner pointed out the gold is 

non-wetting the nickel  in number of locations. What really jumped out at 

me is that "mud flat" appearance on some of the nickel surface regions - a 

"mud flat" appearance is a classic indication of black pad! I recommend 

you complete a cross-section to confirm that you have nickel grain 

boundary attack. 



But since it is Friday, go have a beer and worry about this on Monday!



Dave Hillman

Rockwell Collins

[log in to unmask]









Steve Gregory <[log in to unmask]> 

Sent by: TechNet <[log in to unmask]>

05/04/2007 01:45 PM

Please respond to

TechNet E-Mail Forum <[log in to unmask]>; Please respond to

Steve Gregory <[log in to unmask]>





To

[log in to unmask]

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Subject

Re: [TN] Metalurgists, need assistance













Hi Inge!



Got your pictures posted. Took me a bit, I was swapping our wave

solderpot from 63/37 to HMP. Done now. I'm getting quicker, I can do it

in 20-minutes now. Took me about 45-minutes when I first did it...



Anyways, here's the links:



http://stevezeva.homestead.com/files/Pic1.jpg

http://stevezeva.homestead.com/files/Pic2.jpg

http://stevezeva.homestead.com/files/Pic3.jpg

http://stevezeva.homestead.com/files/Pic4.jpg

http://stevezeva.homestead.com/files/Pic5.jpg

http://stevezeva.homestead.com/files/Pic6.jpg



-Steve-



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord

Sent: Friday, May 04, 2007 12:22 PM

To: [log in to unmask]

Subject: [TN] Metalurgists, need assistance



Have an issue with (randomly) lifted FPGA leads.

Pic 1: good joint after pull test

Pic 2: ditto but high magnification

Pic 3: "rotten" joint after pull test

Pic 4: ditto but high magnification

Pic 5: "rotten" cross section

Pic 6: ditto but high magnification



60Sn on ENIG, obviously a brittle region. Suspect Kirkendall voids, but

the pockets with zillions of Tin spheres (0.1 to 2 um in size) points at

insufficient peak temperature to make 100% melt and good solidifying. If

these little balls were Lead, I could understand, but they are Tin!

Never seen like. Any "quickhead" out there, need fast advice. 



Note: Pic 2, you can see the underlying board pad nickel as dark areas. 

An experienced analyst will hopefully recognize. No Phosphorous peaks!



My Friday headache.



Inge



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