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May 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 30 May 2007 07:27:43 -0500
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I agree with you Werner. However, this is the industry standard. We have
no way to predict the reliability in certain situations. It is
recognized that 100% hole fill is not always achievable, thus the
standard. The standard is J-STD-001, which is supposed to provide
guidelines to ensure reliability of military product, and in harsh
environments. If Evamaria and the rest of us meet the legalistic
requirements, then the hardware should work provided there are no other
issues. At least, that was supposedly the purpose of the standard. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, May 29, 2007 7:27 PM
To: [log in to unmask]
Subject: Re: [TN] Fw: Status of IPC Solder Inspection Criteria

Hi Eva and All,
I am amazed at this discussion-trying to hash-out/meet leagalistic
requirements rather than addressing the actual reliability. For some
application [benign one's] 75 % or even 50% is perfectly adequate, but
for those product having to function in harsher environments only 100%
will not cause premature barrel cracking at the stress concentration
caused by th3e incomplete fill interface.



Werner



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