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| Date: | Wed, 30 May 2007 07:44:36 +0100 |
| Content-Type: | text/plain |
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Brian,
I'm disappointed!
Vertical surface is always the up bit.
19th law of Trekkies - no matter who you are chasing/chasing you in space, you are always the same way up as your opponent. When did you ever see the USS Enterprise do a flip to meet another ship?
Colin W.T. McVean M.Inst.C.T
Production Manager
Artetch Circuits Ltd (www.artetch.co.uk)
Direct Dial 01903 712926
Switch Board 01903 725365
Skype: colin.artetch
40th Anniversary 1967 - 2007
P Before printing , please think about the Environment
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: 30 May 2007 07:37
To: [log in to unmask]
Subject: Re: [TN] Exposed copper (space applications)
How CAN you have a vertical surface in space?
Brian
Gary Bremer wrote:
> Where is it stated that the conductive pattern can not have any exposed
> copper on the vertical surfaces? Is that any empirical data that
> supports a failure mode if there is exposed copper on the vertical
> surfaces of a conductive pattern? I have searched MIL-STD-2000,
> NASA-STD-8739-2 and NASA-STD-8739-3 but can only find that it is
> allowed. Where I work those with PhD's worry about exposed copper on the
> vertical edges of the conductive patterns and are scared to allow to
> move forward because of possible failure modes with a deep space launch.
> For my limited knowledge of metallurgy: after copper is exposed to
> moisture and oxygen, corrosion takes place only on the surface and does
> not migrate any further. I do have access to NHB5300 to see if exposed
> copper was not allowed.
>
>
> Gary Bremer
>
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