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May 2007

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Wed, 30 May 2007 09:36:56 +0300
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How CAN you have a vertical surface in space?

Brian

Gary Bremer wrote:
> Where is it stated that the conductive pattern can not have any exposed 
> copper on the vertical surfaces?  Is that any empirical data that 
> supports a failure mode if there is exposed copper on the vertical 
> surfaces of a conductive pattern? I have searched MIL-STD-2000, 
> NASA-STD-8739-2 and NASA-STD-8739-3 but can only find that it is 
> allowed. Where I work those with PhD's worry about exposed copper on the 
> vertical edges of the conductive patterns and are scared to allow to 
> move forward because of possible failure modes with a deep space launch. 
> For my limited knowledge of metallurgy: after copper is exposed to 
> moisture and oxygen, corrosion takes place only on the surface and does 
> not migrate any further. I do have access to NHB5300 to see if exposed 
> copper was not allowed.
> 
> 
> Gary Bremer
> 
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