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May 2007

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Tue, 29 May 2007 21:07:52 -0700
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Gary I am sure someone on the forum will reply but I just wanted to comment
on those PhD's............

Scared? Might be more like cautious - they perhaps know what it would cost
to get the Maytag repair man to do a site visit in deep
space...................

John

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Bremer
Sent: Tuesday, May 29, 2007 8:29 PM
To: [log in to unmask]
Subject: [TN] Exposed copper (space applications)

Where is it stated that the conductive pattern can not have any exposed 
copper on the vertical surfaces?  Is that any empirical data that supports a

failure mode if there is exposed copper on the vertical surfaces of a 
conductive pattern? I have searched MIL-STD-2000, NASA-STD-8739-2 and 
NASA-STD-8739-3 but can only find that it is allowed. Where I work those 
with PhD's worry about exposed copper on the vertical edges of the 
conductive patterns and are scared to allow to move forward because of 
possible failure modes with a deep space launch. For my limited knowledge of

metallurgy: after copper is exposed to moisture and oxygen, corrosion takes 
place only on the surface and does not migrate any further. I do have access

to NHB5300 to see if exposed copper was not allowed.


Gary Bremer

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